bondtech bondtech bmg ht for funmat ht messing ST and HF versions have

ST and HF versions have the same dimensions

With a tensile modulus of up to 1635 MPa and high impact resistance

This converts your Revo nozzle into a bed sensor without changing the shape

Easy to Process: Easy to cut and weed

Subject to change

bondtech bondtech bmg ht for funmat ht messing ST and HF versions haveBondtech BMG HT High Temperature Extruder for Funmat HT The Bondtech BMG HT is a professional upgrade kit for the Intamsys Funmat HT. With an aluminum housing, high temperature pancake stepper (up to 150 C), and the proven Dual Drive System, it ensures reliable extrusion, fewer material issues, and better print quality even with demanding high temperature materials. Highlights & Benefits High temperature capable: Extruder usable up to 150 C chamber